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ASU chosen as site for one of three semiconductor research and development facilities
"Front-end" refers to the process to convert a blank semiconductor wafer to a completed wafer. Advanced packaging allows multiple semiconductor chips to be combined in a way that mitigates heat ...
JD Supra8d
BIS Issues Interim Final Rule on Advanced Computing Integrated Circuits, Providing Long-Awaited Guidance on Due Diligence Procedures
On January 15, 2025, the U.S. Department of Commerce’s Bureau of Industry and Security (BIS) released an interim final rule ...
Digi Times29d
South Korea invests US$24.79 million in 48 next-gen chip R&D projects
These facilities will focus on 12-inch wafers and advanced semiconductor front-end processes, strengthening the domestic supply chain for semiconductor materials, components, and equipment while ...