理解CIS（ Understanding CMOS Image Sensor） - 知乎专栏
2021年12月11日 · CMOS Image Sensor (CIS) 最早是美国 喷气推进实验室 （Jet Propulsion Laboratory, JPL）的一个研究项目，Dr. Eric Fossum 是业界公认的CIS技术发明人。 1992年，Dr. Eric R. Fossum在美国加州Pasadena(帕萨迪纳)的喷气推进实验室工作，负责NASA一些雄心勃勃的太空探测器的建造和运行。那 ...
CMOS Image Sensor的制造 - 知乎 - 知乎专栏
FSI的一个主要问题在于光进入到 silicon 之前需要穿过较厚的金属布线层，这导致了较多的光子损失，影响了最终的 量子效率 （QE，quantum efficiency）。 特别是像素不断缩小，有效的感光面积占整个pixel的区域变得更加有限。 BSI即是为了解决这个问题而发明，BSI在完成BEOL之后，会将 sensor wafer （wafer #A）翻转过来，然后将其bonding到另一个wafer（wafer. 序：记录下CIS的制造工艺（以普通的RGB image sensor为例）方面较基础的笔记。 公众号“杯拓扩擒” 1. …
CIS（Cmos Image Sensor，即CMOS图像传感器）芯片杂谈 - 吴建 …
2024年1月19日 · 以 车载摄像头 为例，CIS是摄像头的感光元件，被车用摄像头广泛使用，进而构成高级驾驶辅助系统（ADAS）的主要视觉传感器，因此作为自动驾驶的主流应用技术方案，ADAS的关键是以CIS为核心的视觉系统。 图表 1 摄像头模组示意图（左），CIS传感器示意图（右） 1. CIS工作原理. CMOS 图像传感器首先通过感光单元阵列将所获取对象景物的亮度和色彩等信息由光信号转换为电信号；再将电信号按照顺序进行读出并通过 ADC (Analog Digital …
半导体领域的光学应用: CIS关键工艺技术概览 | SK hynix Newsroom
2020年12月17日 · 特别是CMOS图像传感器（CIS）不仅被搭载于数码相机，还被广泛应用于智能手机、平板电脑、CCTV、汽车黑匣子、无人驾驶车辆传感器、虚拟现实（VR）、医疗设备、无人机等各种新兴市场领域。 借此，这一半导体产品线的销售呈现出快速增长势头 1。 基于CMOS的图像传感器的工作过程如下：当可见光波长范围（400-700纳米）的光能聚集在硅衬底的光电二极管（PD）时，硅表面接收光能形成电子-空穴对（electron-hole pair）。 在此过程中产生的电子 …
3D Integration Technologies for the Stacked CMOS Image Sensors
Abstract: In this paper our 3D chip stacking technologies for CMOS image sensors (CISs) are introduced. We have developed wafer-to-wafer bonding technology for back-illuminated CIS (BICIS) and have developed Through-Silicon-Via (TSV) technology and Cu-Cu direct bonding technology for stacked BI-CIS.
Applying Light to Semiconductors: Introducing to CIS Key …
2020年12月10日 · Wafer stacking refers to attaching two wafers together. This is an essential technology for making high-pixel and high-definition CIS products 3. For high-pixel CIS products, pixel arrays and logic circuits are formed on individual wafers separately. These wafers are attached together in the middle of the process, which is called “wafer ...
Development of Reliable, High Performance WLCSP for BSI CMOS …
2020年7月22日 · To meet the urgent market demand for small package size and high reliability performance for automotive CMOS image sensor (CIS) application, wafer level chip scale packaging (WLCSP) technology using through silicon vias (TSV) needs to be developed to replace current chip on board (COB) packages.
Through silicon via: From the CMOS imager sensor wafer
2010年3月1日 · The main application in the market is the CMOS image sensor with the integration of via at AR1. Now based on this first wafer level package of CMOS Image Sensor (CIS), the integration on the z axe will continue by the wafer lens integration for a continuous form factor and low cost module.
The Application of Organic Materials Used in IC Advanced …
4 天之前 · As a key material used in the process of CIS-TSV technology, the high temperature bonding adhesive played an important role as adhesive layer between the glass and CIS wafer. 48 For the CIS wafer, the pixel area was the most important part of each chip, which must be protected from being damaged during the whole packaging process.
Development of 0.5 μm Pixel 3-Wafers Stacked CMOS Image
Abstract: Recently, we have successfully developed the novel 3-wafers stacked & 64MP pixel CMOS image sensor (CIS) with 0.5um pixel including through silicon deep contact module and face-to-back Cu-to-Cu hybrid bonding module. In this paper, we demonstrate how to prepare and optimize the 3-wafers stacking processes.